Foam board (common types include polystyrene foam EPS, extruded polystyrene foam XPS, etc.) is widely used in building insulation, product packaging, cold chain logistics and other fields due to its light weight, excellent thermal insulation and cushioning performance, but the deformation problem will directly weaken its function - such as the deformation of the thermal insulation layer reduces the thermal insulation efficiency of the wall, and the deformation of the packaging foam causes damage to the inner products. To solve the deformation problem of foam board, it is necessary to systematically implement measures from the dimensions of material intrinsic characteristics, environmental adaptation, and structural design. The core is to crack the deformation incentives in a targeted manner.

XPS board (Extruded Polystyrene Board) is an excellent thermal insulation material with a number of characteristics that make it widely used in the field of building insulation:

Foam board (common types include polystyrene foam EPS, extruded polystyrene foam XPS, etc.) is widely used in building insulation, product packaging, cold chain logistics and other fields due to its light weight, excellent thermal insulation and cushioning performance, but the deformation problem will directly weaken its function - such as the deformation of the thermal insulation layer reduces the thermal insulation efficiency of the wall, and the deformation of the packaging foam causes damage to the inner products. To solve the deformation problem of foam board, it is necessary to systematically implement measures from the dimensions of material intrinsic characteristics, environmental adaptation, and structural design. The core is to crack the deformation incentives in a targeted manner.